Laser Stencil

Laser cut SMT stencil. We'll create your personalized kit and send it directly to you.

Printed Circuit Board Manufacturing Capabilities

Items Mass production Prototype PCB
Maximum Multilayer: 1-10 layer (No blind, no buried via and online instant quote)
PCB material type: FR1, CEM1, FR4, Aluminum core
Maximum board size: 360mm X 360mm 500mm X 500mm
Shape Dimension Accuracy: ± 0.1mm
Material Thickness range: 0.40mm--2.4mm
Board thickness tolerance: ± 10%(t ≥ 0.8mm)
Board thickness tolerance: ± 10%(t<0.8mm)
Medium thickness: 0.075mm--5.0mm
Minimum line width: 6mil 4mil
Minimum spacing: 6mil 4mil
Outer layer copper thickness: 35um--70um
Inner layer copper thickness: 17um--70um
Drill Diameter (Mechanical): 0.3mm--6.35mm 0.25mm--6.35mm
Hole Diameter (Mechanical): 0.3mm--6.30mm
Hole Tolerance (Mechanical): 0.08mm
Hole Position Tolerance: 0.09mm
Board Thickness and Aperture Ratio: 8:1
Solder mask type: photosensitive ink
Minimum Solder Bridge Width: 0.1mm
Minimum Solder Isolation Ring: 0.1mm
Plug hole diameter: 0.25mm--0.60mm
Solder mask hardness: 6H
Solderability s/mm: 245℃ /5 Sec, Float 288℃ / 10 Sec (FR4)
Quality spec: GB/T.4588,IPC-A-600F(single sided)
Surface plating: OSP, HASL, Immersion gold

PCB circuit board normal manufacturing time ( lead time ): 3~4 day (PCB prototype), Mass production:5~7 day.

Full automatic processing more than 75%, guarantee your printed circuit board quality and lead time.